Compositionsnagcupbsbbiznfealascd96.5±0.23.0±0.20.5±0.2< 0.1< 0.1< 0.1< 0.001< 0.02< 0.001< 0.03< 0.002 applicationsour Sn96.5ag3.0cu0.5 Solder Bar Is A Commonly Used Product By Adoption Of Lead-free Soldering Technique. It Features Relatively High Cost, But Bright Solder Joints And Outstanding Performance. Fully Complied With Rohs Compliance.  this Solder Bar Is An Ideal Replacement To The Traditional Leaded Solder Sn63pb37.the Lead Content Of Our Solder Bar Is Generally Less Than 100ppm. This Product Is Composed Of 96.5% Tin, 3% Silver, And 0.5% Copper. Due To The Adoption Of High-purity Raw Materials, Our Product Can Offer Superb Fluidity During The Soldering Process. It Can Significantly Reduce Such Technical Problems As Bridging, Icicle, And Some Others. It Is Ideal For Both Wave Soldering And Dip Soldering Processes, Which Have High Demand For Environmental Protection. featureseutectic Alloy.bridge-free And Icicle-free Soldering.smooth, Bright, Well-formed Fillets, Free Of Gross Micro-cracks, Irrespective Of The Cooling Rate.good Through-hole Penetration.good Topside Fillet Formation.dross Rate Equal Or Lower Than Tin-lead Solder.also Performs Well In Selective And Dip Soldering....
æ–° Bmk/cas 5413 Bmk Cas 16648 Pmk Cas 13605/æ–° Pmk Cas 28578-16-7cas 1451-82-7 Cas 69673-92-3 Cas 49851-31-2 Bdo Cas 110-63-4 (s)-3-羟基-γ-ä¸å†…é…¯ ...
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![3-Glycidoxypropylmethyldiethoxysilane [3-(2,3-Epoxypropoxy)propyl]diethoxy methylsilane CAS NO.: 2897-60-1 from ZHENGZHOU BOND PERFORMANCE MATERIALS CO., LTD](https://companyprods.dubaiyellowpagesonline.com/1669622985.png "3-Glycidoxypropylmethyldiethoxysilane [3-(2,3-Epoxypropoxy)propyl]diethoxy methylsilane CAS NO.: 2897-60-1 from ZHENGZHOU BOND PERFORMANCE MATERIALS CO., LTD")
